to complete semiconductor chip

The manufacturing processes to complete semiconductor chips can be classified to two major processes, front-end process and post-process.

Front-end processto make silicon wafer where the integrated circuits are stored.

Post-processto complete semiconductor chip using the silicon wafer.

Our semiconductor molding machine takes change of molding process for the wired semiconductor chip with the integrated circuits.

Post-process

  • Dicing of silicon wafer

  • Chip mounting

  • Wire bonding

  • Molding

  • Triming & Forming

  • Functional inspection