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Semiconductor Technological Topic
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| The IC market requires the Fine pitch, longer and thinner gold wiring on High Performance IC. Daiichi PPG technology has been approved its molding quality at these fine pitched wire packaging with die-up handling. |
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| HFC Technology |
| Hydraulic Floating Cavity Bar |
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| For the BGA Packaging, the compensation of substrate thickness variation is the bottleneck in mold quality. HFC technology is the top of the ultimate solution for this difficulty besides the spring technology and wedge type. |
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| FDD Technology |
| Flying Die Detection Unit |
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FDD unit detects the misplaced (flying) die on the leadframe before mold clamp.
So that there is no damage on mold surface. With simple maintenance and structure, FDD protects your precious mold and materials.
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| MPH Technology |
| Moving Pre-heater unit |
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MPH unit will ensure the proper temperature of the substrate before placed on the mold by waiting just behind of the mold set. MPH will move with unloader to serve for each mold.
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| 4SPC Technology |
| 4 Strips per chase Molding |
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When you need to convert from conventional press to Auto molding system, you can still use the current leadframe for mass production by placing 4 strips on one chase (L/F max size : 31mm x 270mm)
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| HDLF Technology |
| High Density Leadframe Molding |
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The need for high density type of leadframe layout is increasing.
With GP-PRO80 or 120 ton press, you can mold Max 75mm x 270mm with confirmed quality.
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| VAM Technology |
| Vacuum Assisted Molding |
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For the stack die type of package, it is necessary to vacuum the cavity for complete compound transfer in order to prevent the internal void and incomplete fill. VAM is the solution for this new requirement.
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| FAM Technology |
| Film Assisted Molding |
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For the variety of IC packaging purpose, FAM technology will be the most reliable and ultimate method for future encapsulation trend Exposed Die Package and ceramic substrate package. Future demand for transparent compound.
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